Processor |
Processor cores |
4 |
Processor frequency |
3.6 GHz |
Processor cache |
8 MB |
Processor lithography |
14 nm |
Processor codename |
Coffee Lake |
Processor family |
Intel Xeon E |
Box |
N |
Processor socket |
LGA 1151 (Socket H4) |
Processor ARK ID |
191039 |
Cooler included |
N |
Processor model |
E-2234 |
Processor threads |
8 |
Processor operating modes |
64-bit |
Processor boost frequency |
4.8 GHz |
Component for |
Server/Workstation |
Technical details |
Vendor |
Intel |
Product type |
Processor |
Status |
Launched |
Maximum resolution & refresh rate (DisplayPort) |
N/A |
Launch date |
Q2’19 |
Weight & dimensions |
Processor package size |
37.5 x 37.5 mm |
Other features |
Graphics output |
N/A |
Graphics |
Discrete graphics card |
N |
On-board graphics card model |
Not available |
Discrete graphics card model |
Not available |
On-board graphics card |
N |
Processor special features |
Intel® Quick Sync Video Technology |
N |
Intel® InTru™ 3D Technology |
N |
Intel® Clear Video HD Technology (Intel® CVT HD) |
N |
Intel® AES New Instructions (Intel® AES-NI) |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Intel Trusted Execution Technology |
Y |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel TSX-NI |
Y |
Intel® Secure Key |
Y |
Intel 64 |
Y |
Intel® OS Guard |
Y |
Intel Virtualization Technology for Directed I (O (VT-d)) |
Y |
Intel Clear Video Technology |
N |
Intel Software Guard Extensions (Intel SGX) |
Y |
Intel Virtualization Technology (VT-x) |
Y |
Intel® Optane™ Memory Ready |
Y |
Intel® Memory Protection Extensions (Intel® MPX) |
Y |
Intel® Boot Guard |
Y |
Intel® vPro™ Technology |
Y |
Intel® Hyper Threading Technology (Intel® HT Technology) |
Y |
Intel® Turbo Boost Technology |
2.0 |
Features |
Execute Disable Bit |
Y |
Idle States |
Y |
Thermal Monitoring Technologies |
Y |
Scalability |
1S |
CPU configuration (max) |
1 |
Embedded options available |
N |
PCI Express configurations |
1×16,2×8,1×8+2×4 |
Maximum number of PCI Express lanes |
16 |
Supported instruction sets |
SSE4.1,SSE4.2,AVX 2.0 |
PCI Express slots version |
3.0 |
Power |
Thermal Design Power (TDP) |
71 W |
Operational conditions |
Tcase |
69.3 °C |
Tjunction |
100 °C |
Memory |
Maximum internal memory supported by processor |
128 GB |
Memory types supported by processor |
DDR4-SDRAM |
Memory clock speeds supported by processor |
2666 MHz |
Memory channels supported by processor |
Dual |
ECC supported by processor |
Y |
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